We are excited to invite you to visit CN Mould & Plastic at K 2025, the world’s leading trade fair for plastics and rubber, held in Düsseldorf, Germany. This is a fantastic opportunity to explore the latest innovations in low-pressure molding technology and discover how our solutions can elevate your products.
Hall 8B, Booth H75
Date: October 8–15, 2025
At our booth, you’ll have the chance to:
Witness live demonstrations of our low-pressure molding technology and its applications across industries.
Discuss your projects with our technical experts and explore customized solutions.
Learn about the advantages of low-pressure molding for encapsulating and protecting sensitive components (e.g., electronics, sensors, connectors) with minimal stress and superior precision.
Our PCB Overmolding technology offers:
Gentle Encapsulation: Ideal for delicate electronic components.
Design Flexibility: Enables complex geometries and lightweight structures.
Cost Efficiency: Reduces material waste and cycle times.
Sustainability: Compatible with eco-friendly materials and processes.
We look forward to welcoming you at Hall 8B, Booth H75 and sharing how our low-pressure molding solutions can drive your success.
See you at K 2025!
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