05-06
The cooperation between mold manufacturing enterprises and users is carried out in the form of "contracts". The main contents of the contract include three aspects: ① The accuracy, quality,...
Core requirement: This customer needs to provide an efficient, lightweight, and environmentally friendly packaging protection solution for the micro circuit boards (PCBS) of their new-generation smartwatches to replace the traditional potting process. The product needs to meet the performance requirements of being waterproof, resistant to high and low temperatures, and resistant to mechanical shock. At the same time, the production cycle needs to be significantly shortened and costs reduced.
1. Traditional process bottleneck : The customer originally used epoxy resin potting process, which had problems such as long curing time (more than 30 minutes per piece), high temperature and high pressure causing component damage (The yield rate is low), and non-recyclable materials.
2. Environmental pressure : The latest EU RoHS regulation requires the ban of certain chemicals, and the original materials cannot meet the standards.
3. Efficiency and cost : The customer plans to increase the annual production , but the traditional process equipment takes up a lot of space and consumes a lot of energy, making it difficult to meet the expansion requirements.
1. Low temperature and low pressure protection element : Injection pressure < 5 bar, temperature < 180°C, avoid high temperature and high pressure damage to precision element.
2. Shorten production cycle : The material is filled in 5 seconds and fully cured in 30 seconds. The production time of a single piece is shortened compared with the traditional process
3. Environmental compliance : Materials certified by RoHS and REACH, recyclable rate that is high, helping customers meet international environmental requirements.
4. Integrated packaging : The circuit board can be fully covered in a single injection molding process without the need for additional gluing or assembly steps, reducing human intervention.
5. Provide mold-material-process parameters for full-process customized development to adapt to the PCB design of different sizes for customers.
The sealing performance of injection molding is enhanced, and the waterproof performance of the product has passed the strict industry tests, meeting the demands of scenarios such as swimming and outdoor sports.
The rapid prototyping feature of low pressure molding process significantly shortens the product development cycle. The efficiency of the customer's verification process from design to mass production was improved for the first time, successfully catching the market window period of the peak season for consumer electronics.
The rapid curing property of CN team's low-pressure injection molding process has greatly benefited us during the prototype testing stage. In the past, the potting process required repeated adjustments to the mold and curing parameters. However, the LPM technology, through real-time pressure sensors and intelligent temperature control systems, achieved packaging integrity in the first mold test, shortening the development cycle. The stability of the automated production line has far exceeded expectations. The batch defects caused by bubble and delamination issues in the potting process in the past have completely disappeared. Through LPM technology, we have successfully reduced the reliance on a single supplier and plan to replicate this model in the field of smart home sensor packaging.
